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ESWA
2007
105views more  ESWA 2007»
13 years 4 months ago
Applying rough sets to prevent customer complaints for IC packaging foundry
Packaging is classified as one of back-end processes in the integrated circuits (ICs) manufacturing, highly capital-intensive and involves complex processes. Unlike the front-end...
Hsu-Hao Yang, Tzu-Chiang Liu, Yen-Ting Lin
CORR
2007
Springer
74views Education» more  CORR 2007»
13 years 4 months ago
Packaging of RF Mems Switching Functions on Alumina Substrate
The expending development of wireless communication requires strong demands for components with improved capabilities. RF MEMS devices offer a variable alternative to conventional...
M.-K. El Khatib, Arnaud Pothier, Pierre Blondy