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ISCA
2003
IEEE
168views Hardware» more  ISCA 2003»
13 years 9 months ago
Temperature-Aware Microarchitecture
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...