ASPDAC
2010
ACM
13 years 2 months ago
2010
ACM
In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal ...
ASPDAC
2006
ACM
13 years 8 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
VTS
2006
IEEE
13 years 10 months ago
2006
IEEE
— In this paper, an algorithm for scan vector ordering, PEAKASO, is proposed to minimize the peak temperature during scan testing. Given a circuit with scan and the scan vectors,...
ISQED
2007
IEEE
13 years 10 months ago
2007
IEEE
— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...
DATE
2008
IEEE
13 years 10 months ago
2008
IEEE
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
In this paper, we present and evaluate three temperature-sensitive loop parallelization strategies for array-intensive applications executed on chip multiprocessors in order to re...