ASPDAC
2012
ACM
12 years 16 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
CISIS
2010
IEEE
13 years 10 months ago
2010
IEEE
Abstract—Program performance optimisations, feedbackdirected iterative compilation and auto-tuning systems [1] all assume a fixed estimation of execution time given a fixed inp...