PATMOS
2000
Springer
13 years 8 months ago
2000
Springer
Abstract. Reduction of chip packaging and cooling costs for deep sub-micron SystemOn-Chip (SOC) designs is an emerging issue. We present a simulation-based methodology able to real...
CODES
1999
IEEE
13 years 9 months ago
1999
IEEE
The power consumption due to the HW/SW communication on system-level buses represents one of the major contributions to the overall power budget. A model to estimate the switching...