EOR
2007
13 years 4 months ago
2007
: New semiconductor wafer fabrication facilities use Front Opening Unified Pods (FOUPs) as a common unit of wafer transfer. Since the number of pods is limited due to high costs, a...
WSC
2008
13 years 7 months ago
2008
This paper focuses on a lot merging/splitting problem in a semiconductor wafer fabrication facility. In the fab, two or more lots can be merged into a single lot if routes and all...
WSC
2008
13 years 7 months ago
2008
In this paper, multiple orders per job type formation and release strategies are described for semiconductor wafer fabrication facilities (wafer fabs). Different orders are groupe...
WSC
2007
13 years 7 months ago
2007
Semiconductor wafer fabrication facilities (wafer fabs) are among the most complex production facilities. A large product variety, hundreds of processing steps per product, hundre...