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DFT
2005
IEEE
178views VLSI» more  DFT 2005»
13 years 10 months ago
Inter-Plane Via Defect Detection Using the Sensor Plane in 3-D Heterogeneous Sensor Systems
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with sensors located on the top plane, and inter-plane vias connecting these to other...
Glenn H. Chapman, Vijay K. Jain, Shekhar Bhansali