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    ASPLOS
    2004
    ACM
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    Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
    13 years 10 months ago
    Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
    Download  cobweb.ecn.purdue.edu
    Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
    Mohamed A. Gomaa, Michael D. Powell, T. N. Vijayku...
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