ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...