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ISLPED
2006
ACM
99views Hardware» more  ISLPED 2006»
12 years 3 months ago
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
12 years 6 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
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