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GLVLSI
2010
IEEE
212views VLSI» more  GLVLSI 2010»
13 years 8 months ago
An integrated thermal estimation framework for industrial embedded platforms
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
Andrea Acquaviva, Andrea Calimera, Alberto Macii, ...
DSD
2009
IEEE
84views Hardware» more  DSD 2009»
13 years 10 months ago
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...