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    DAC
    2006
    ACM
    115views Computer Architecture» more  DAC 2006»
    Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
    14 years 5 months ago
    Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
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    Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
    Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
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