Sciweavers

Share
TDSC
2010
144views more  TDSC 2010»
8 years 1 months ago
On the Thermal Attack in Instruction Caches
The instruction cache has been recognized as one of the least hot units in microprocessors, which leaves the instruction cache largely ignored in onchip thermal management. Consequ...
Joonho Kong, Johnsy K. John, Eui-Young Chung, Sung...
MJ
2011
288views Multimedia» more  MJ 2011»
8 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
8 years 4 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
IPPS
2010
IEEE
8 years 5 months ago
Robust control-theoretic thermal balancing for server clusters
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...
Yong Fu, Chenyang Lu, Hongan Wang
ICRA
2010
IEEE
150views Robotics» more  ICRA 2010»
8 years 5 months ago
Thermal calibration of a 3 DOF ultra high-precision robot operating in industrial environment
——while dealing with sub-micrometer precision robots, thermal expansion is the most significant source of inaccuracy. Thermal variations in the environment, in the robot parts a...
Emanuele Lubrano, Reymond Clavel
TCAD
2002
123views more  TCAD 2002»
8 years 6 months ago
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
Abstract--Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three
Ting-Yuan Wang, Charlie Chung-Ping Chen
TCAD
2008
167views more  TCAD 2008»
8 years 7 months ago
System-Level Dynamic Thermal Management for High-Performance Microprocessors
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
TC
2008
8 years 7 months ago
Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...
CORR
2010
Springer
184views Education» more  CORR 2010»
8 years 7 months ago
Image Pixel Fusion for Human Face Recognition
In this paper we present a technique for fusion of optical and thermal face images based on image pixel fusion approach. Out of several factors, which affect face recognition perfo...
Mrinal Kanti Bhowmik, Debotosh Bhattacharjee, Mita...
ERSA
2006
113views Hardware» more  ERSA 2006»
8 years 8 months ago
A Sensor Distribution Algorithm for FPGAs with Minimal Dynamic Reconfiguration Overhead
Thermal monitoring of a design plays a vital role to ensure safe and reliable thermal operating conditions. Thermal monitoring by employing thermal sensors is a popular technique ...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
books