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ICCAD
2005
IEEE
134views Hardware» more  ICCAD 2005»
13 years 10 months ago
Fast thermal simulation for architecture level dynamic thermal management
As power density increases exponentially, runtime regulation of operating temperature by dynamic thermal managements becomes necessary. This paper proposes a novel approach to the...
Pu Liu, Zhenyu Qi, Hang Li, Lingling Jin, Wei Wu, ...
DATE
2006
IEEE
152views Hardware» more  DATE 2006»
13 years 10 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...