TVLSI
2008
13 years 4 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
Thermal hot spots and temperature gradients on the die need to be minimized to manufacture reliable systems while meeting energy and performance constraints. In this work, we solve...
DAC
2008
ACM
14 years 5 months ago
2008
ACM
In deep submicron circuits, thermal hot spots and high temperature gradients increase the cooling costs, and degrade reliability and performance. In this paper, we propose a low-co...