ISPD
2003
ACM
13 years 9 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
ECRTS
2007
IEEE
13 years 11 months ago
2007
IEEE
Today’s CPUs consume a significant amount of power and generate a high amount of heat, requiring an active cooling system to support reliable operations. In case of cooling sys...