HPCA
2002
IEEE
13 years 9 months ago
2002
IEEE
This paper proposes the use of formal feedback control theory as a way to implement adaptive techniques in the processor architecture. Dynamic thermal management (DTM) is used as ...
GLVLSI
2010
IEEE
13 years 9 months ago
2010
IEEE
Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal mana...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
ISPD
2003
ACM
13 years 9 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
ISCA
2003
IEEE
13 years 9 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
HAPTICS
2003
IEEE
13 years 9 months ago
2003
IEEE
This research is focused on the development of a thermal display and understanding the nature of the thermal cues used to identify objects haptically. The objective of the present...
ISPD
2005
ACM
13 years 10 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
ICCD
2005
IEEE
13 years 10 months ago
2005
IEEE
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
As semiconductor manufacturing technology scales to smaller device sizes, the power consumption of clocked digital ICs begins to increase. Dynamic voltage and frequency scaling (D...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...