ISCAS
2006
IEEE
13 years 10 months ago
2006
IEEE
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
ISQED
2007
IEEE
13 years 10 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
ISQED
2007
IEEE
13 years 10 months ago
2007
IEEE
— In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingl...
ISCA
2007
IEEE
13 years 10 months ago
2007
IEEE
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
ICPP
2007
IEEE
13 years 10 months ago
2007
IEEE
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
CODES
2007
IEEE
13 years 10 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ISPASS
2008
IEEE
13 years 11 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
IPPS
2008
IEEE
13 years 11 months ago
2008
IEEE
The modeling of power and thermal behavior of modern processors requires challenging validation approaches, which may be complex and in some cases unreliable. In order to address ...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...
APPT
2009
Springer
13 years 11 months ago
2009
Springer
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...