RTCSA
2009
IEEE
13 years 11 months ago
2009
IEEE
Distributed real-time embedded systems have stringent requirements for key performance properties, such as endto-end timeliness and reliability, in order to operate properly. In r...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
ISPASS
2009
IEEE
13 years 11 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
ASPLOS
2010
ACM
13 years 11 months ago
2010
ACM
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate therm...