ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
RTCSA
2000
IEEE
13 years 9 months ago
2000
IEEE
In this paper, we address the problem of guaranteeing end-to-end (ETE) delay of packets in a distributed system where the technique of time division multiplex access (TDMA)is adop...