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ISLPED
2006
ACM
99views Hardware» more  ISLPED 2006»
12 years 3 months ago
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
books