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    Electromigration lifetimes and void growth at low cumulative failure probability
    13 years 5 months ago
    Electromigration lifetimes and void growth at low cumulative failure probability
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    We studied electromigration (EM) lifetimes and void growth at low cumulative failure probability. We carried out EM test in damascene Cu lines using sudden-death type test structu...
    Hideaki Tsuchiya, Shinji Yokogawa
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