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    DATE
    1997
    IEEE
    97views Hardware» more  DATE 1997»
    Analysis of 3D conjugate heat transfers in electronics
    13 years 9 months ago
    Analysis of 3D conjugate heat transfers in electronics
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    An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software : a conducti...
    J. P. Fradin, L. Molla, B. Desaunettes
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