TASE
2011
IEEE
12 years 11 months ago
2011
IEEE
—For multiclass flow line models, we identify a class of service times that allow a decomposition of the system into subsets of servers called channels. In each channel, the cus...
CCE
2006
13 years 4 months ago
2006
In the past few years, Rapid Thermal Processes (RTP) have gained acceptance as mainstream technology for semi-conductors manufacturing. These processes are characterized by a sing...
WSC
2000
13 years 5 months ago
2000
Designing semiconductor cluster tool systems is a complicated task due to the nature of automatic operations and various configurations of modules and task response priorities of ...
WSC
2007
13 years 6 months ago
2007
The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...