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    ASPDAC
    2007
    ACM
    164views Hardware» more  ASPDAC 2007»
    Thermal-Aware 3D IC Placement Via Transformation
    13 years 9 months ago
    Thermal-Aware 3D IC Placement Via Transformation
    Download  cadlab.cs.ucla.edu
    - 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
    Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
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