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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
9 years 3 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
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