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    DATE
    2009
    IEEE
    112views Hardware» more  DATE 2009»
    Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
    13 years 11 months ago
    Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
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    —Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
    Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...
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