In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
This paper presents a design methodology for RF CMOS Low Noise Amplifiers (LNA). This methodology uses a current–based MOSFET model, which allows a detailed analysis of an LNA f...
An important primitive in the hardware implementations of linear DSP transforms is a circuit that can multiply an input value by one of several different preset constants. We prop...
This paper presents an approach for simulation of mixed analog-digital CMOS integrated circuits, aiming at estimating crosstalk effects due to current pulses drawn from voltage s...
Gabriella Trucco, Giorgio Boselli, Valentino Liber...
A novel CMOS current reference circuit with very low temperature coefficient is realized, by compensating the temperature performance of the resistor. This circuit gives out a cur...