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DAC
2012
ACM
13 years 2 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
SBCCI
2004
ACM
100views VLSI» more  SBCCI 2004»
15 years 5 months ago
Design of RF CMOS low noise amplifiers using a current based MOSFET model
This paper presents a design methodology for RF CMOS Low Noise Amplifiers (LNA). This methodology uses a current–based MOSFET model, which allows a detailed analysis of an LNA f...
Virgínia Helena Varotto Baroncini, Oscar da...
DAC
2004
ACM
16 years 22 days ago
Multiple constant multiplication by time-multiplexed mapping of addition chains
An important primitive in the hardware implementations of linear DSP transforms is a circuit that can multiply an input value by one of several different preset constants. We prop...
James C. Hoe, Markus Püschel, Peter Tummeltsh...
SBCCI
2004
ACM
134views VLSI» more  SBCCI 2004»
15 years 5 months ago
An approach to computer simulation of bonding and package crosstalk in mixed-signal CMOS ICs
This paper presents an approach for simulation of mixed analog-digital CMOS integrated circuits, aiming at estimating crosstalk effects due to current pulses drawn from voltage s...
Gabriella Trucco, Giorgio Boselli, Valentino Liber...
GLVLSI
2003
IEEE
167views VLSI» more  GLVLSI 2003»
15 years 5 months ago
New approach to CMOS current reference with very low temperature coefficient
A novel CMOS current reference circuit with very low temperature coefficient is realized, by compensating the temperature performance of the resistor. This circuit gives out a cur...
Jiwei Chen, Bingxue Shi