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166
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ICCAD
2009
IEEE
15 years 3 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
157
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SODA
2012
ACM
13 years 8 months ago
2012
ACM
We consider the design of strategyproof cost-sharing mechanisms. We give two simple, but extremely versatile, black-box reductions, that in combination reduce the cost-sharing mec...
193
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GLOBECOM
2007
IEEE
16 years 10 days ago
2007
IEEE
—This paper deals with the analytical evaluation of the average delay, the packet-loss rate (PLR) and the throughput of a multi-user (MU) wireless system that capitalizes on a cr...
156
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ICWE
2007
Springer
16 years 5 days ago
2007
Springer
: The goal of this work is to present the software WebRatio 5, which is a good representative of a new generation of CASE tools for model-driven design of Web applications. WebRati...
187
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CODES
2004
IEEE
15 years 9 months ago
2004
IEEE
In this paper, a novel method for high-level specification and validation of SoC designs using UML is proposed. UML is introduced as a formal model of specification for SoC design...