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NOCS
2010
IEEE
14 years 10 months ago
Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
Chih-Hao Chao, Kai-Yuan Jheng, Hao-Yu Wang, Jia-Ch...
ISCA
2009
IEEE
318views Hardware» more  ISCA 2009»
15 years 6 months ago
Thread criticality predictors for dynamic performance, power, and resource management in chip multiprocessors
With the shift towards chip multiprocessors (CMPs), exploiting and managing parallelism has become a central problem in computer systems. Many issues of parallelism management boi...
Abhishek Bhattacharjee, Margaret Martonosi
HPCA
2001
IEEE
16 years 1 days ago
Dynamic Thermal Management for High-Performance Microprocessors
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...
David Brooks, Margaret Martonosi
VEE
2012
ACM
234views Virtualization» more  VEE 2012»
13 years 7 months ago
REEact: a customizable virtual execution manager for multicore platforms
With the shift to many-core chip multiprocessors (CMPs), a critical issue is how to effectively coordinate and manage the execution of applications and hardware resources to overc...
Wei Wang, Tanima Dey, Ryan W. Moore, Mahmut Aktaso...
IISWC
2006
IEEE
15 years 5 months ago
Application-Aware Power Management
Abstract— This paper presents our approach for applicationaware power management. We combine continuous monitoring of critical workload indicators, online power and performance m...
Karthick Rajamani, Heather Hanson, Juan Rubio, Sor...