—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
With the shift towards chip multiprocessors (CMPs), exploiting and managing parallelism has become a central problem in computer systems. Many issues of parallelism management boi...
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...
With the shift to many-core chip multiprocessors (CMPs), a critical issue is how to effectively coordinate and manage the execution of applications and hardware resources to overc...
Wei Wang, Tanima Dey, Ryan W. Moore, Mahmut Aktaso...
Abstract— This paper presents our approach for applicationaware power management. We combine continuous monitoring of critical workload indicators, online power and performance m...
Karthick Rajamani, Heather Hanson, Juan Rubio, Sor...