The scaling of CMOS technology into the nanometer era enables the fabrication of highly integrated systems, which increasingly contain analog and/or RF parts. However, scaling into...
—In this paper, a binary hypothesis distributed detection problem in correlated wireless sensor networks with cooperative relays deployment is considered. In particular, the effe...
Mohammed W. Baidas, Ahmed S. Ibrahim, Karim G. Sed...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Starting from a model of the within-die systematic variations using principal components analysis, a model is proposed for estimation of the parametric yield, and is then applied ...
Most side-channel attacks that have been published in the open literature assume known- or chosen-message adversarial scenarios. In this paper, we analyze the increase of the attac...