The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
Today's feature-rich multimedia products require embedded system solution with complex System-on-Chip (SoC) to meet market expectations of high performance at a low cost and l...
T. S. Rajesh Kumar, C. P. Ravikumar, R. Govindaraj...
Functional validation of microprocessors is growing in complexity in current and future microprocessors. Traditionally, the different components (or validation collaterals) used i...
Sreekumar V. Kodakara, Deepak Mathaikutty, Ajit Di...
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...
Title of thesis: EFFICIENT AND ACCURATE STATISTICAL TIMING ANALYSIS FOR NON-LINEAR NON-GAUSSIAN VARIABILITY WITH INCREMENTAL ATTRIBUTES Ashish Dobhal, Master of Science, 2006 Thes...