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FTEDA   2008
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FTEDA
2008
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13 years 4 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar
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