An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: P. Bruschi, V. Nurra, M. Piotto
• Keywords: Chip Surface, CORR 2008, Education, Flow Sensor, Thermal Mass Flow