Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this paper. Verification of the assumptions was done by Finite Element Modeling, as well as comparison with experimental measured temperature profiles.

• Type: Journal
• Year: 2007
• Where: MR
• Authors: Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans
• Keywords: Convective Reflow, MR 2007, Printed Circuit Board Assembly, Robotics, Simplified Analytical Model