CMOS-MEMS integration: why, how and what?

CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing. Poly-SiGe provides the desired material properties for MEMS applications at significantly lower temperatures compared to Poly-Si. A case study of a CMOS-integrated SiGe gyroscope will be presented. Categories and Subject Descriptors B.8.0 [Hardware]: Performance and Reliability – general. General Terms Measurement, Performance, Reliability, Experimentation. Keywords CMOS-MEMS integration, poly-SiGe, technology.

• Type: Conference
• Year: 2006
• Where: ICCAD
• Authors: Ann Witvrouw
• Keywords: CMOS-MEMS Integration, Hardware, ICCAD 2006, Mems, Processing Mems