Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ

The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies were studied. As the bonding temperature decreased, the composite properties of ACF, such as water absorption, glass transition temperature (Tg), elastic modulus (E0 ) and coefficient of thermal expansion (a), were improved. These results were due to the difference in network structures of cured ACFs which were fully cured at different temperatures. From small angle X-ray scattering (SAXS) test result, ACFs cured at lower temperature, had denser network structures. The reliability performances of flip chip on organic substrate assemblies using ACFs were also investigated as a function of bonding temperatures. The results in thermal cycling test (

• Type: Journal
• Year: 2008
• Where: MR
• Authors: J. S. Hwang, M. J. Yim, K. W. Paik
• Keywords: Bonding Temperature, Composite Properties, Flip Chip, MR 2006, MR 2008