MR 2006 | Sciweavers

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MR
2008

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Stress intensities at the triple junction of a multilevel thin film package

13 years 4 months ago

Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...

Insu Jeon, Ki-Ju Kang, Seyoung Im

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MR
2008

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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ

13 years 4 months ago

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The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...

J. S. Hwang, M. J. Yim, K. W. Paik

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MR
2008

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Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

13 years 4 months ago

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This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...

J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...

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MR
2006

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CCGA packages for space applications

13 years 4 months ago

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Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electro...

Reza Ghaffarian

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MR
2006

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ESD robustness of thin-film devices with different layout structures in LTPS technology

13 years 4 months ago

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The electrostatic discharge (ESD) robustness of different thin-film devices, including three diodes and two thin-film transistors (TFTs) in low-temperature polysilicon (LTPS) tech...

Chih-Kang Deng, Ming-Dou Ker

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MR
2006

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Electronic circuit reliability modeling

13 years 4 months ago

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The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are reviewed. The simulation tools and failure equivalent circuits are described. The review in...

Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, ...

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MR
2006

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Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs

13 years 4 months ago

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Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...

Cora Salm, André J. Hof, Fred G. Kuper, Jur...

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MR
2006

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New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors

13 years 4 months ago

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In Kyung Lee, Se Re Na Yun, Kyosun Kim, Chong-Gun ...

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MR
2006

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Drop impact reliability testing for lead-free and lead-based soldered IC packages

13 years 4 months ago

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Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...

Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...

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MR
2006

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Reliability of large periphery GaN-on-Si HFETs

13 years 4 months ago