High-precision interconnect analysis

10 years 1 months ago
High-precision interconnect analysis
— Integrated circuits have evolved to a stage where interconnections significantly limit their performance and functional complexity. We introduce a set of tools to perform highly accurate three-dimensional capacitance and resistance/thermal calculations of interconnect structures. We automatically generate these structures from layout information and a given process description. The main enhancement of our work is that we extract the interconnect characteristics after a complete and accurate topography simulation with previous optional lithography analysis, instead of elementary geometric blocks derived from simple analytical models. The capacitance and resistance/thermal extractor simulators are based on optimized finite-element methods, and the topography simulators use a cellular data-based approach.
Rui Martins, Wolfgang Pyka, Rainer Sabelka, Siegfr
Added 23 Dec 2010
Updated 23 Dec 2010
Type Journal
Year 1998
Where TCAD
Authors Rui Martins, Wolfgang Pyka, Rainer Sabelka, Siegfried Selberherr
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