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DATE
2006
IEEE

A logarithmic full-chip thermal analysis algorithm based on multi-layer Green's function

9 years 12 months ago
A logarithmic full-chip thermal analysis algorithm based on multi-layer Green's function
This paper derives the multi-layer heat conduction Green’s function, by integrating the eigen-expansion technique and the classic transmission line theories, and presents a logarithmic full-chip thermal analysis algorithm, which is verified by comparisons with a computational fluid dynamics tool (FLUENT). The paper considers Dirichlet’s and general heat convection boundary conditions at chip surfaces. Experimental results show that the algorithm offers superior computing speed, compared to FLUENT and traditional Green’s function based methods. The paper also studies the limitations of the traditional single-layer thermal model.
Baohua Wang, Pinaki Mazumder
Added 10 Jun 2010
Updated 10 Jun 2010
Type Conference
Year 2006
Where DATE
Authors Baohua Wang, Pinaki Mazumder
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