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2004
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Low-Overhead Core Swapping for Thermal Management

9 years 4 months ago
Low-Overhead Core Swapping for Thermal Management
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature management techniques. To combat these trends, we evaluate the thermal efficiency of the microcore architecture, a deeply decoupled processor core with larger structures factored out as helper engines. We further investigate activity migration (core swapping) as a means of controlling the thermal profile of the chip in this study. Specifically, the microcore architecture presents an ideal platform for core swapping thanks to helper engines that maintain the state of each process in a shared fabric surrounding the cores. This results in significantly reduced migration overhead, enabling seamless swapping of cores. Our results show that our thermal mechanisms outperform traditional Dynamic Thermal Management (DTM) techniques by reducing the performance hit caused by slowing/swapping of cores. Our experimental results...
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita
Added 02 Jul 2010
Updated 02 Jul 2010
Type Conference
Year 2004
Where PACS
Authors Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita Shayesteh, Timothy Sherwood
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