Sciweavers

Share
ICCD
2005
IEEE

Monitoring Temperature in FPGA based SoCs

10 years 15 days ago
Monitoring Temperature in FPGA based SoCs
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatures and local hotspots. Sophisticated packaging techniques have become essential to maintain the health of the chip. In addition to static techniques to reduce the temperature, dynamic thermal management techniques are essential. Such techniques rely on accurate on-chip temperature information. In this paper, we present the design of a system that monitors the temperatures at various locations on the FPGA. This system is composed of a controller interfacing to an array of temperature sensors that are implemented on the FPGA fabric. Such a system can be used to implement dynamic thermal management techniques. We cross validate the sensor readings with values obtained from HotSpot, a pre-RTL architectural level thermal modeling tool.
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R
Added 16 Mar 2010
Updated 16 Mar 2010
Type Conference
Year 2005
Where ICCD
Authors Sivakumar Velusamy, Wei Huang, John Lach, Mircea R. Stan, Kevin Skadron
Comments (0)
books