Sciweavers

Share
DATE
2010
IEEE

Properties of and improvements to time-domain dynamic thermal analysis algorithms

9 years 10 months ago
Properties of and improvements to time-domain dynamic thermal analysis algorithms
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation costs during the IC design process. We analyze the performance and accuracies of a variety of time-domain dynamic thermal analysis techniques and use our findings to propose a new analysis technique that improves performance by 38–138× relative to popular methods such as the fourth-order globally adaptive Runge-Kutta method while maintaining accuracy. More precisely, we prove that the step sizes of step doubling based globally adaptive fourth-order Runge-Kutta method and Runge-Kutta-Fehlberg methods always converge to a constant value regardless of the initial power profile, thermal profile, and error threshold during dynamic thermal analysis. Thus, these widely-used techniques are unable to adapt to the requirements of individual problems, resulting in poor performance. We also determine the effect of us...
Xi Chen, Robert P. Dick, Li Shang
Added 10 Jul 2010
Updated 10 Jul 2010
Type Conference
Year 2010
Where DATE
Authors Xi Chen, Robert P. Dick, Li Shang
Comments (0)
books