| Stress-driven 3D-IC placement with TSV keep-out zone and regularity study Recent countries visiting this post |  |
 | 8 | United States |
 | 3 | Taiwan |
 | 1 | Germany |
| Stress-driven 3D-IC placement with TSV keep-out zone and regularity study Recent countries visiting this post | |
| 8 | United States |
| 3 | Taiwan |
| 1 | Germany |