This paper presents a new method for interactive rendering of globally illuminated static scenes. Global illumination is decomposed into view-independent (diffuse) and view-depend...
Rui Bastos, Kenneth E. Hoff III, William C. Wynn, ...
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
V. Kheterpal, V. Rovner, T. G. Hersan, D. Motiani,...
Many casually taken "tourist" photographs comprise of architectural objects like houses, buildings, etc. Reconstructing such 3D scenes captured in a single photograph is...
In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
Motivated by applications in architecture and manufacturing, we discuss the problem of covering a freeform surface by single curved panels. This leads to the new concept of semi-d...
Helmut Pottmann, Alexander Schiftner, Pengbo Bo, H...