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SLIP
2003
ACM
13 years 10 months ago
A hierarchical three-way interconnect architecture for hexagonal processors
The problem of interconnect architecture arises when an array of processors needs to be integrated on one chip. With the deep sub-micron technology, devices become cheap while wir...
Feng Zhou, Esther Y. Cheng, Bo Yao, Chung-Kuan Che...
ICCD
2002
IEEE
114views Hardware» more  ICCD 2002»
14 years 2 months ago
Balancing the Interconnect Topology for Arrays of Processors between Cost and Power
High performance SoC requires nonblocking interconnections between an array of processors built on one chip. With the advent of deep sub-micron technologies, switches are becoming...
Esther Y. Cheng, Feng Zhou, Bo Yao, Chung-Kuan Che...
DFT
2003
IEEE
132views VLSI» more  DFT 2003»
13 years 10 months ago
Level-Hybrid Optoelectronic TESH Interconnection Network
This paper discusses a hybrid optoelectronic scheme for a new interconnection network, "Tori connected mESHes (TESH)". The major features of TESH are the following: it i...
Vijay K. Jain, Glenn H. Chapman
FCCM
2007
IEEE
111views VLSI» more  FCCM 2007»
13 years 11 months ago
A Structural Object Programming Model, Architecture, Chip and Tools for Reconfigurable Computing
A new platform for reconfigurable computing has an object-based programming model, with architecture, silicon and tools designed to faithfully realize this model. The platform is ...
Michael Butts, Anthony Mark Jones, Paul Wasson
ISCA
2006
IEEE
130views Hardware» more  ISCA 2006»
13 years 5 months ago
Area-Performance Trade-offs in Tiled Dataflow Architectures
: Tiled architectures, such as RAW, SmartMemories, TRIPS, and WaveScalar, promise to address several issues facing conventional processors, including complexity, wire-delay, and pe...
Steven Swanson, Andrew Putnam, Martha Mercaldi, Ke...