12 search results - page 1 / 3 » A reliability-driven placement procedure based on thermal-fo... |
MR
2006
13 years 4 months ago
2006
This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
CASES
2010
ACM
13 years 2 months ago
2010
ACM
The performance of most embedded systems is critically dependent on the memory hierarchy performance. In particular, higher cache hit rate can provide significant performance boos...
GECCO
2004
Springer
13 years 10 months ago
2004
Springer
Genetic algorithms require relatively large computation time to solve optimization problems, especially in VLSI CAD such as module placement. Therefore, island-based parallel GAs a...
SPATIALCOGNITION
2000
Springer
13 years 8 months ago
2000
Springer
We present an approach to spatial inference which is based on the procedural semantics of spatial relations. In contrast to qualitative reasoning, we do not use discrete symbolic m...
DAC
2000
ACM
13 years 9 months ago
2000
ACM
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...