41 search results - page 2 / 9 » A routerless system level interconnection network for 3D int... |
CORR
2012
Springer
12 years 1 months ago
2012
Springer
In the perspective of a sustainable urban planning, it is necessary to investigate cities in a holistic way and to accept surprises in the response of urban environments to a part...
SLIP
2009
ACM
13 years 12 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
GLVLSI
2009
IEEE
13 years 3 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
3DIC
2009
IEEE
13 years 8 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
NOCS
2009
IEEE
14 years 5 days ago
2009
IEEE
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...