4 search results - page 1 / 1 » Accurate, Pre-RTL Temperature-Aware Design Using a Parameter... |
TC
2008
13 years 4 months ago
2008
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
ISCA
2003
IEEE
13 years 10 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...