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AAIM
2008
Springer
13 years 11 months ago
2008
Springer
APCSAC
2007
IEEE
13 years 8 months ago
2007
IEEE
Many years of CMOS technology scaling have resulted in increased power densities and higher core temperatures. Power and temperature concerns are now considered to be a primary cha...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
DATE
2008
IEEE
13 years 11 months ago
2008
IEEE
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
ICCAD
2008
IEEE
14 years 1 months ago
2008
IEEE
Abstract—On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of syst...