A Pin-Grid-Array (PGA) package router is presented in this paper. Given a chip cavity with a number of I/O pads around its boundary and an equivalent number of pins distributed on...
Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in...
Many practical routing problems such as BGA, PGA, pin redistribution and test xture routing involve routing with interchangeable pins. These routing problems, especiallypackage la...
This paper proposes a scheme for automatic re-distribution layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed man...
Background: High-throughput screens comparing growth rates of arrays of distinct micro-organism cultures on solid agar are useful, rapid methods of quantifying genetic interaction...
Conor Lawless, Darren J. Wilkinson, Alexander Youn...